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14.02.2014

Testing of printed circuit boards for resistance to mechanical stress by using strain gauges from HBM


Testing of printed circuit boards for resistance to mechanical stress by using strain gauges from HBM

Printed circuit Board with electronic components in the devices of passenger cars, commercial vehicles or smart phones must withstand multiple pressures arising out of their use. Even small cracks can damage the entire electronics system. To ensure that this does not happen, manufacturers also test printed a paid resistance to mechanical stress. The strain gages from HBM ensure the accuracy of the measuring results.
Cars are moving along a cobblestone road, a goods vehicle to navigate your way around a bumpy construction site. In summer they are exposed to heat in winter ‒ influence of negative temperatures. All this sets high demands for separate hardware components, such as printed circuit boards. They are an essential element of electronic modules. When developing the prototype the designer should be extremely precise to measure the impact of mechanical loads, such as vibration and thermal deformation can cause the appearance of cracks between the Board and disposed thereon SMD-components, which can then lead to failure. Thus, they can guarantee that the PCB will function normally up to limit load, and will not be damaged in the production process.
Production of cars and trucks is just one application field of strain gauges, where it is necessary to conduct tests on the mechanical load; in a vast number of areas, the development of laptops, to manufacture wagon trains, electronic equipment is also subject to constant exposure to vibrations. "In principle, there is always the risk of damage and cracks in any connection between the circuit Board and disposed thereon SMD components," explains Christof Salcher, product Manager of the company HBM. This can lead to very costly consequences, for example, when the electronics in the car stops working due to a small crack. Manufacturers in recent years, increasingly require their suppliers to confirm the sustainability of printed circuit boards to mechanical stress. "Value of deformation is the only parameter that can most accurately predict the stress-strain state of the PCB under load. The deformation may be measured with strain gages placed to do this directly on a printed circuit Board", continues Salcher.
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